Task statements

  • Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
  • Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
  • Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
  • Maintain processing, production, and inspection information and reports.
  • Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
  • Load and unload equipment chambers and transport finished product to storage or to area for further processing.
  • Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
  • Inspect equipment for leaks, diagnose malfunctions, and request repairs.
  • Stamp, etch, or scribe identifying information on finished component according to specifications.
  • Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
  • Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
  • Load semiconductor material into furnace.
  • Count, sort, and weigh processed items.
  • Scribe or separate wafers into dice.
  • Calculate etching time based on thickness of material to be removed from wafers or crystals.
  • Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
  • Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.

Career and skills data: O*NET 31.0 (onetcenter.org). Figures are published survey estimates, not real-time market data.